Patent Assignment
Reel/Frame 044462/0560
Assignment of Assignor's Interest
Recorded: 2017-12-21
Pages: 6
Assignors
CHO, YUN-RAE
Executed: 2017-10-27
KIM, SUNDAE
Executed: 2017-10-27
BAEK, HYUNGGIL
Executed: 2017-10-27
BAEK, NAMGYU
Executed: 2017-10-27
SHIN, SEUNGHUN
Executed: 2017-10-27
WON, DONGHOON
Executed: 2017-10-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate, Method of Sawing Substrate, and Semiconductor Device