Patent Assignment
Reel/Frame 044467/0391
Assignment of Assignor's Interest
Recorded: 2017-12-21
Pages: 3
Assignors
LIN, WEI-HENG
Executed: 2017-12-05
SHAO, TUNG-LIANG
Executed: 2017-12-06
TUNG, CHIH-HANG
Executed: 2017-12-06
YU, CHEN-HUA
Executed: 2017-12-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure Including Plurality of Chips Along with Air Gap and Manufacturing Method Thereof