Patent Assignment
Reel/Frame 044473/0650
Assignment of Assignor's Interest
Recorded: 2017-12-22
Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2016-03-07
KIM, HYOUNG JOON
Executed: 2016-03-11
KIM, JONG RIP
Executed: 2016-03-07
OH, KYUNG SEOB
Executed: 2016-03-07
SHIN, UNG HUI
Executed: 2016-03-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Package and Method of Manufacturing the Same
Application:
15/853,014 →
Publication:
US 2018/0138127
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.