Patent Assignment
Reel/Frame 044475/0532
Assignment of Assignor's Interest
Recorded: 2017-12-25
Pages: 4
Assignors
LIN, JIE-MO
Executed: 2017-12-19
KUO, SHU-WEI
Executed: 2017-12-19
CHENG, WEI-YUAN
Executed: 2017-12-19
YANG, CHEN-TSAI
Executed: 2017-12-19
Assignees
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
INTELLECTUAL PROPERTY INNOVATION CORPORATION
RM.417, BLDG. 52, NO. 195, SEC. 4, CHUNG-HSING RD., CHU-TUNG,, HSINCHU, TAIWAN
Covered Property
(1)
Redistribution Layer Structure of Semiconductor Package