Patent Assignment
Reel/Frame 044487/0150
Assignment of Assignor's Interest
Recorded: 2017-12-26
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-12-15
YEE, KUO-CHUNG
Executed: 2017-12-15
YU, CHUN-HUI
Executed: 2017-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof