IP Library Assignment 044490/0966
Patent Assignment
Reel/Frame 044490/0966

Assignment of Assignor's Interest

Recorded: 2017-12-27 Pages: 6
Assignors
AMANAPU, HARI P.
Executed: 2017-12-22
SURISETTY, CHARAN V.
Executed: 2017-12-26
PATLOLLA, RAGHUVEER R.
Executed: 2017-12-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Forming Dual Metallization Interconnect Structures in Single Metallization Level
Application: 15/855,133 →
Publication: US 2019/0198444