Patent Assignment
Reel/Frame 044498/0467
Assignment of Assignor's Interest
Recorded: 2017-12-28
Pages: 4
Assignor
KIM, YONGHOON
Executed: 2017-09-29
Assignee
SAMSUNG ELECTRONICS, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Reduced Stress