Patent Assignment
Reel/Frame 044501/0675
Assignment of Assignor's Interest
Recorded: 2017-12-28
Pages: 7
Assignors
KIM, MINSUNG
Executed: 2017-11-24
PARK, MYOUNG SOO
Executed: 2017-11-24
YEO, DONGYUN
Executed: 2017-11-24
SUNG, DOUGYONG
Executed: 2017-11-24
LEE, SUHO
Executed: 2017-11-24
JEON, YUN-KWANG
Executed: 2017-11-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electrostatic Chuck, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device Using the Same