Patent Assignment
Reel/Frame 044508/0594
Assignment of Assignor's Interest
Recorded: 2017-12-29
Pages: 3
Assignor
LU, WEN-LONG
Executed: 2017-12-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure having a Second Encapsulant Extending in a Cavity Defined by a First Encapsulant