IP Library › Assignment 044509/0954
Patent Assignment
Reel/Frame 044509/0954

Assignment of Assignor's Interest

Recorded: 2017-12-31 Pages: 5
Assignors
ZHONG, ZHIBAI
Executed: 2017-12-06
YANG, LIXUN
Executed: 2017-12-06
ZHENG, JINJIAN
Executed: 2017-12-06
LEE, CHIA-EN
Executed: 2017-12-05
HSU, CHEN-KE
Executed: 2017-12-06
KANG, JUNYONG
Executed: 2017-12-08
Assignee
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1721-1725 LVLING RD, SIMING DISTRICT, XIAMEN, 361009, CHINA
Covered Property (1)
Bonding Electrode Structure of Flip-Chip Led Chip and Fabrication Method
Application: 15/859,543 →
Publication: US 2018/0145220
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065302/0223 →