Patent Assignment
Reel/Frame 044517/0481
Assignment of Assignor's Interest
Recorded: 2018-01-02
Pages: 3
Assignors
LIN, JING-CHENG
Executed: 2017-09-26
CHENG, LI-HUI
Executed: 2017-09-26
TSAI, PO-HAO
Executed: 2017-09-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming Same