Patent Assignment
Reel/Frame 044524/0778
Assignment of Assignor's Interest
Recorded: 2018-01-03
Pages: 2
Assignors
YORISUE, TOMOHIRO
Executed: 2017-09-26
IDO, YOSHITO
Executed: 2017-09-26
INOUE, TAIHEI
Executed: 2017-09-26
MATSUDA, HARUMI
Executed: 2017-09-26
Assignee
ASAHI KASEI KABUSHIKI KAISHA
1-105, KANDA JINBOCHO, CHIYODA-KU,, TOKYO, 1018101, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Polyimide Production Method, and Semiconductor Device