Patent Assignment
Reel/Frame 044527/0434
Assignment of Assignor's Interest
Recorded: 2018-01-03
Pages: 3
Assignors
WU, CHENG-TA
Executed: 2017-12-19
TZENG, KUO-HWA
Executed: 2017-12-19
WANG, CHIH-HAO
Executed: 2017-12-19
TU, YEUR-LUEN
Executed: 2017-12-19
YU, CHUNG-YI
Executed: 2017-12-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Soi Substrate, Semiconductor Device and Method for Manufacturing the Same