Patent Assignment
Reel/Frame 044528/0394
Assignment of Assignor's Interest
Recorded: 2018-01-03
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Interconnection Structure