Patent Assignment
Reel/Frame 044532/0506
Assignment of Assignor's Interest
Recorded: 2018-01-04
Pages: 3
Assignor
MAKIYAMA, HIDEKI
Executed: 2017-10-30
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Semiconductor Device