Patent Assignment
Reel/Frame 044535/0889
Assignment of Assignor's Interest
Recorded: 2018-01-04
Pages: 7
Assignors
SON, YOON HO
Executed: 2017-12-18
SHIN, JAE UK
Executed: 2017-12-22
KO, YONG SUN
Executed: 2017-12-22
PARK, IM SOO
Executed: 2017-12-22
CHUNG, SUNG YOON
Executed: 2017-12-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Enlarged Contact Hole and Methods of Forming the Same