Patent Assignment
Reel/Frame 044541/0144
Assignment of Assignor's Interest
Recorded: 2018-01-05
Pages: 8
Assignors
LEE, DONGSOO
Executed: 2017-11-29
CHUNG, WONKEUN
Executed: 2017-11-29
NA, HOONJOO
Executed: 2017-11-29
BAE, SUYOUNG
Executed: 2017-11-29
SONG, JAEYEOL
Executed: 2017-11-29
LEE, JONGHAN
Executed: 2017-11-29
JUNG, HYUNGSUK
Executed: 2017-11-29
HYUN, SANGJIN
Executed: 2017-11-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same