Patent Assignment
Reel/Frame 044542/0284
Assignment of Assignor's Interest
Recorded: 2018-01-05
Pages: 13
Assignors
CHEN, HSIA-WEI
Executed: 2017-12-27
CHANG, CHIH-YANG
Executed: 2017-12-27
YANG, CHIN-CHIEH
Executed: 2017-12-27
YANG, JEN-SHENG
Executed: 2017-12-27
SHIH, SHENG-HUNG
Executed: 2017-12-27
HSIAO, TUNG-SHENG
Executed: 2017-12-27
CHU, WEN-TING
Executed: 2017-12-27
LIAO, YU-WEN
Executed: 2017-12-27
CHEN, I-CHING
Executed: 2017-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Forming a Flat Bottom Electrode via (Beva) Top Surface for Memory