Patent Assignment
Reel/Frame 044553/0719
Assignment of Assignor's Interest
Recorded: 2018-01-08
Pages: 12
Assignors
CHEN, TAI-YU
Executed: 2017-12-29
HSU, WEN-SUNG
Executed: 2017-12-29
KUO, SHENG-LIANG
Executed: 2017-12-29
PAN, CHI-WEN
Executed: 2017-12-29
CHEN, JEN-CHUAN
Executed: 2017-12-29
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package with Improved Heat Dissipation