Patent Assignment
Reel/Frame 044566/0113
Assignment of Assignor's Interest
Recorded: 2018-01-08
Pages: 4
Assignors
LIN, TSUNG-YU
Executed: 2017-12-18
WANG, PEI-YU
Executed: 2017-12-19
HSU, CHUNG-WEI
Executed: 2017-12-18
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and a Method of Manufacturing the Same