Patent Assignment
Reel/Frame 044578/0127
Assignment of Assignor's Interest
Recorded: 2018-01-09
Pages: 6
Assignors
TADAYON, POOYA
Executed: 2018-01-09
BOHR, MARK
Executed: 2018-01-08
WALCZYK, JOE
Executed: 2018-01-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density and Fine Pitch Interconnect Structures in an Electric Test Apparatus