Patent Assignment
Reel/Frame 044578/0745
Assignment of Assignor's Interest
Recorded: 2018-01-09
Pages: 4
Assignors
LEE, TZUNG-HUI
Executed: 2016-05-20
KUO, HUNG-JUI
Executed: 2016-05-20
HO, MING-CHE
Executed: 2016-05-20
HUANG, TZU-YUN
Executed: 2016-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package, Redistribution Circuit Structure, and Method of Fabricating the Same