Patent Assignment
Reel/Frame 044584/0388
Assignment of Assignor's Interest
Recorded: 2018-01-10
Pages: 6
Assignors
CHOI, JUNG-HYUCK
Executed: 2017-10-31
LEE, HAE-WANG
Executed: 2017-10-31
HA, HYOUN-JEE
Executed: 2017-10-31
PARK, CHUL-HONG
Executed: 2017-10-31
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same