Patent Assignment
Reel/Frame 044590/0723
Assignment of Assignor's Interest
Recorded: 2018-01-10
Pages: 4
Assignors
HUANG, CHIEN-WEN
Executed: 2017-07-31
CHIANG, CHIA-WEI
Executed: 2017-07-27
FAN, WEN-JENG
Executed: 2017-07-26
FANG, LI-CHIH
Executed: 2017-07-26
Assignee
POWERTECH TECHNOLOGY INC.
NO.26, DATONG RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 30352, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof