IP Library › Assignment 044593/0745
Patent Assignment
Reel/Frame 044593/0745

Assignment of Assignor's Interest

Recorded: 2018-01-11 Pages: 4
Assignors
DUNLOP, JAMES BERNARD
Executed: 2012-07-23
SPANGLER, LELAND JOSEPH
Executed: 2012-08-03
Assignee
SAMTEC, INC.
5050 LIST DRIVE, COLORADO SPRINGS, COLORADO, 80919
Covered Property (1)
Method of Manufacturing an Implantable Electrode Array by Forming Packages Around the Array Control Modules After the Control Modules Are Bonded to Substrates
Patent: 9,950,154 →
Application: 15/713,291 →
Publication: US 2018/0008818
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 11, 2018
From: SAMTEC, INC.
To: STRYKER CORPORATION
Reel/Frame 044593/0889 →
Assignment of Assignor's Interest Jan 11, 2018
From: JANIK, JOHN; BRINDLEY, ROBERT; TANG, EDWARD CHIA-NING
To: STRYKER CORPORATION
Reel/Frame 045045/0039 →
Change of Address Dec 18, 2024
From: STRYKER CORPORATION
To: STRYKER CORPORATION
Reel/Frame 069737/0184 →