Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates

1. A method of assembling an implantable electrode array, said method including the steps of:

packaging at least one control module according to the steps of:

forming a containment ring on a first surface of a substrate;

mounting a control module to the first surface of the substrate so that the control module is disposed in the containment ring;

applying a coating to the first surface of the substrate so that the coating is disposed in the containment ring around the control module so that the coating forms a non-porous shell in the containment ring around the control module;

bonding a lid over the containment ring so that the lid extends over the control module and the shell so as to form at least one packaged control module

embedding the at least one packaged control module in a flexible carrier; and

electrically connecting the at least one packaged control module to at least one electrode that is disposed over or embedded in the flexible carrier.

2. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step of packaging the at least one control module:

said step of forming a containment ring of the first surface of the substrate is performed by forming the containment ring so that the containment ring is at least partially located inwardly of an outer perimeter of the containment ring;

in said step of applying a coating to the first surface of the substrate, the coating is applied to portions of the first surface located outside of the containment ring; and

after said step of applying a coating to the first surface of the substrate, removing portions of the coating located outside of the containment ring from the substrate; and

in said step of embedding the at least one packaged control module in the flexible carrier, the packaged control module is embedded in the carrier so that the control module, the shell and the containment ring are disposed in the carrier and the first surface of first surface of the substrate is located adjacent an outer surface of the flexible carrier.

3. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step forming the containment ring, the containment ring is formed so that when the control module is mounted to the first surface of said substrate, the containment ring extends above the control module;

in said step of applying the coating to the first surface of the substrate, the coating is applied to extend over the control module so that, after said step of bonding the lid over the containment ring, a portion of the shell is located between the control module and the lid.

4. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step forming the containment ring, the containment ring is formed so that when the control module is mounted to the first surface of said substrate, the containment ring extends above the control module;

in said step of applying the coating to the first surface of the substrate, the coating is applied to extend over both the containment ring and the control module;

after said step of applying the coating to the first step of the control module, a portion of the coating over the containment ring is removed to expose a face of containment ring; and

in said step of bonding a lid over the containment ring, the lid is bonded to the exposed face of the containment ring so that, after said step of bonding the lid over the containment ring, a portion of the shell is located between the control module and the lid.

5. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step of embedding the at least one packaged control module in the flexible carrier, the at least one packaged control module is embedded in the flexible carrier so that the substrate is located adjacent a first surface of the flexible carrier; and

in said step of electrically connecting the at least one packaged electrode to the at least at least one electrode, the at least one packaged control module is connected to an electrode disposed over or embedded in a second surface of the flexible carrier, the second surface being opposite the first surface of the flexible carrier.

6. The method of assembling an implantable electrode array of claim 1 , further including the step of

forming at least one electrode on a superstrate and wherein:

in said step of embedding the at least one packaged control module in the flexible carrier, the at least one packaged control module is embedded in the flexible carrier so that the substrate is located adjacent a first surface of the flexible carrier; and

said step of electrically connecting the at least one electrode to the at least one packaged control module is performed by mounting the superstrate with the at least one electrode to a second surface of the flexible carrier, the second surface being opposite the first surface, and electrically connecting the at least one electrode on the superstrate to the control module.

7. The method of assembling an implantable electrode array of claim 6 wherein, in said step of mounting the superstrate to the second surface of the flexible carrier, the superstrate is secured to the lid of the packaged control module.

8. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step of embedding the at least one packaged control module in the flexible carrier, the at least one packaged control module is embedded in the flexible carrier so that the substrate is located adjacent a first surface of the flexible carrier;

in said of forming the containment ring on the substrate, the containment ring is formed on a substrate that, in addition to the containment ring, the substrate includes at least one electrically conductive post that extends outwardly from the first surface of the substrate;

in said step of mounting the control module to the first surface of the substrate, the control module is mounted to the substrate so as to establish at least one electrical connection between the control module and the at least one post;

in said step of embedding the at least one packaged control module in the flexible carrier, the at least one post is embedded in the flexible carrier; and

said step of electrically connecting the at least one packaged control module to the at least one electrode is formed by placing at least one electrode on a second surface of the flexible carrier, the second surface being opposite the first surface and electrically connecting the at least one post to the at least one electrode.

9. The method of assembling an implantable electrode array of claim 8 , wherein in said step of forming the containment ring on the first surface of the substrate, the at least one post that extends outwardly from the substrate is at least partially simultaneously formed.

10. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step of mounting the control module to the first surface of the substrate, the control module is mounted to the substrate so the control module is spaced away from the first surface of the substrate; and

in said step of applying a coating to the first surface of the substrate, the coating is applied so as to disposed between the first surface of the substrate and the control module so that a portion of the shell is located between the first surface of the substrate and the control module.

11. The method of assembling an implantable electrode array of claim 1 , wherein:

in said step of mounting the control module to the first surface of the substrate, the control module is mounted to a substrate that has a second surface opposite the first surface; and

in said step of electrically connecting the at least one packaged control module to at least one electrode, the at least one packaged control module is electrically connected to an electrode disposed on the second surface of the substrate.