Patent Assignment
Reel/Frame 044611/0023
Assignment of Assignor's Interest
Recorded: 2018-01-12
Pages: 7
Assignors
CHOI, JU-IL
Executed: 2018-01-09
MOON, KWANG-JIN
Executed: 2018-01-09
SEO, JU-BIN
Executed: 2018-01-09
LIM, DONG-CHAN
Executed: 2018-01-09
FUJISAKI, ATSUSHI
Executed: 2018-01-10
LEE, HO-JIN
Executed: 2018-01-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices, Semiconductor Packages, and Methods of Manufacturing the Semiconductor Devices