IP Library › Assignment 044617/0103
Patent Assignment
Reel/Frame 044617/0103

Assignment of Assignor's Interest

Recorded: 2018-01-15 Pages: 5
Assignors
LEE, HOI-JIN
Executed: 2017-11-01
CHAE, KYOUNG-KUK
Executed: 2017-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Integrated Circuit Including Filler Cell
Application: 15/869,486 →
Publication: US 2019/0012423