Patent Assignment
Reel/Frame 044623/0856
Assignment of Assignor's Interest
Recorded: 2018-01-15
Pages: 3
Assignors
YAMAKOSHI, HIDEAKI
Executed: 2017-11-22
HASHIMOTO, TAKASHI
Executed: 2017-11-22
ABE, SHINICHIRO
Executed: 2017-11-22
OMIZU, YUTO
Executed: 2017-11-22
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and a Manufacturing Method Thereof
Application:
15/871,818 →
Publication:
US 2018/0286881