Assignment of Assignor's Interest

Recorded: 2018-01-15 Pages: 10

Assignors

CHENG, CHENG-WEI

Executed: 2017-12-27

LEE, SANGHOON

Executed: 2017-12-29

LEOBANDUNG, EFFENDI

Executed: 2017-12-27

MO, RENEE T.

Executed: 2017-12-26

Assignee

NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504

Covered Property (1)

Surface Roughness of Iii-V Fin Formed on Silicon Sidewall by Implementing Sacrificial Buffers

Patent: 10,205,003 →

Application: 15/871,830 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.