Patent Assignment
Reel/Frame 044626/0049
Assignment of Assignor's Interest
Recorded: 2018-01-16
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-12-19
HU, HSIEN-PIN
Executed: 2017-12-14
LIN, JING-CHENG
Executed: 2017-12-14
LU, SZU-WEI
Executed: 2017-12-14
HOU, SHANG-YUN
Executed: 2017-12-14
WEI, WEN-HSIN
Executed: 2017-12-14
SHIH, YING-CHING
Executed: 2017-12-14
WU, CHI-HSI
Executed: 2017-12-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structures and Methods of Forming the Same