Patent Assignment
Reel/Frame 044642/0216
Assignment of Assignor's Interest
Recorded: 2018-01-17
Pages: 4
Assignors
CHEN, CHIEN-CHIH
Executed: 2017-12-12
YANG, TSUNG-YI
Executed: 2017-12-12
HUNG, CHUNG-I
Executed: 2017-12-12
CHENG, MU-HAN
Executed: 2017-12-11
CHEN, TZU-SHIN
Executed: 2017-12-12
YEH, SU-YU
Executed: 2017-12-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Bonding Wafers and Bonding Tool