Patent Assignment
Reel/Frame 044644/0857
Assignment of Assignor's Interest
Recorded: 2018-01-17
Pages: 3
Assignors
DARMAWIKARTA, KRISTOF
Executed: 2018-01-03
BOYAPATI, SRI RANGA SAI
Executed: 2018-01-08
TANAKA, HIROKI
Executed: 2018-01-08
MAY, ROBERT A.
Executed: 2018-01-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Sacrificial Dielectric for Lithographic via Formation to Enable via Scaling in High Density Interconnect Packaging