Patent Assignment
Reel/Frame 044644/0982
Assignment of Assignor's Interest
Recorded: 2018-01-17
Pages: 4
Assignors
ZHANG, YUN
Executed: 2018-01-09
ZHU, ZIFANG
Executed: 2018-01-09
MA, TAO
Executed: 2018-01-09
CHEN, LUMING
Executed: 2018-01-09
WANG, JING
Executed: 2018-01-09
Assignee
SUZHOU SHINHAO MATERIALS LLC
2358 CHANGAN ROAD, WUJIANG DISTRICT, SUZHOU, JIANGSU, 215200, CHINA
Covered Property
(1)
A Method for Preparing Electroplating Copper Layer with Preferred Growth Orientation
Application:
15/745,695 →
Publication:
US 2020/0080215
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.