Corrective Assignment to Correct the Incorrect Appl. No 15/715,051 Previously Recorded at Reel: 043719 Frame: 0132. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2017-11-01 Pages: 5

Assignors

HE, ZUOPENG

Executed: 2017-09-01

ZHU, JI GUANG

Executed: 2017-09-01

Assignees

18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA

18 WEN CHANG ROAD, ECONOMICAL-TECHNOLOGICAL, DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100176, CHINA

Covered Property (1)

Method of Manufacturing an Interconnect Structure by Forming Metal Layers in Mask Openings

Patent: 10,553,536 →

Application: 15/716,261 →

Publication: US 2018/0151488

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.