IP Library Assignment 044653/0854
Patent Assignment
Reel/Frame 044653/0854

Assignment of Assignor's Interest

Recorded: 2018-01-18 Pages: 4
Assignors
SEOL, YONG JIN
Executed: 2017-03-22
LEE, YONG KOON
Executed: 2017-03-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package Module
Application: 15/870,593 →
Publication: US 2018/0158791
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →