Patent Assignment
Reel/Frame 044658/0237
Assignment of Assignor's Interest
Recorded: 2018-01-18
Pages: 4
Assignors
YANAI, HIDEHIRO
Executed: 2011-12-13
HIYAMA, SHIN
Executed: 2011-12-13
KAKUDA, TORU
Executed: 2011-12-13
SHIMADA, TOSHIYA
Executed: 2011-12-13
AMANO, TOMIHIRO
Executed: 2011-12-13
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Baffle Structure of the Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.