Patent Assignment
Reel/Frame 044661/0272
Assignment of Assignor's Interest
Recorded: 2018-01-19
Pages: 5
Assignors
LIN, CHUN-CHENG
Executed: 2018-01-04
HSIEH, CHING-HUA
Executed: 2018-01-04
YU, CHEN-HUA
Executed: 2018-01-10
LIU, CHUNG-SHI
Executed: 2018-01-10
LIN, CHIH-WEI
Executed: 2018-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same