Patent Assignment
Reel/Frame 044661/0296
Assignment of Assignor's Interest
Recorded: 2018-01-19
Pages: 5
Assignors
CHEN, YI-HSIU
Executed: 2017-12-20
LIAO, EBIN
Executed: 2017-12-21
SHIH, HONG-YE
Executed: 2017-12-21
CHIOU, WEN-CHIH
Executed: 2017-12-20
KO, JIA-LING
Executed: 2017-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit Structure and Method of Manufacturing the Same