Patent Assignment
Reel/Frame 044687/0235
Assignment of Assignor's Interest
Recorded: 2018-01-22
Pages: 4
Assignors
LEE, KAI-HSUAN
Executed: 2018-01-05
LAI, BO-YU
Executed: 2018-01-05
CHUI, CHI-ON
Executed: 2018-01-05
YANG, CHENG-YU
Executed: 2018-01-05
CHEN, YEN-TING
Executed: 2018-01-05
YEONG, SAI-HOOI
Executed: 2018-01-05
YANG, FENG-CHENG
Executed: 2018-01-05
CHEN, YEN-MING
Executed: 2018-01-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same