Patent Assignment
Reel/Frame 044689/0094
Assignment of Assignor's Interest
Recorded: 2017-12-05
Pages: 8
Assignors
BARK, SU-HYUN
Executed: 2017-11-16
AHN, SANG-HOON
Executed: 2017-11-16
KIM, YOUNG-BAE
Executed: 2017-11-17
OH, HYEOK-SANG
Executed: 2017-11-16
LEE, WOO-JIN
Executed: 2017-11-16
SEO, HOON-SEOK
Executed: 2017-11-16
KANG, SUNG-JIN
Executed: 2017-11-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same