IP Library › Assignment 044696/0359
Patent Assignment
Reel/Frame 044696/0359

Assignment of Assignor's Interest

Recorded: 2018-01-23 Pages: 4
Assignors
CHEN, YI-FAN
Executed: 2013-10-23
HSIEH, TUNG-HENG
Executed: 2013-10-23
HOU, CHIN-SHAN
Executed: 2013-10-23
WU, YU-BEY
Executed: 2013-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method and Apparatus for Integrated Circuit Layout
Patent: 9,995,998 →
Application: 15/188,753 →
Publication: US 2016/0370698
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Nov 9, 2017
From: CLOSURE SYSTEMS INTERNATIONAL INC.; EVERGREEN PACKAGING INC.; GRAHAM PACKAGING COMPANY, L.P.; GRAHAM PACKAGING PET TECHNOLOGIES INC.
To: THE BANK OF NEW YORK MELLON
Reel/Frame 044722/0528 →
Termination and Release of Security Interest in Patents Dec 20, 2019
From: THE BANK OF NEW YORK MELLON, AS COLLATERAL AGENT
To: CLOSURE SYSTEMS INTERNATIONAL INC.
Reel/Frame 051396/0463 →
Termination and Release of Security Interest in Patents Dec 23, 2019
From: THE BANK OF NEW YORK MELLON
To: CLOSURE SYSTEMS INTERNATIONAL INC.
Reel/Frame 051412/0943 →