Method and apparatus for integrated circuit layout
A method includes receiving a layout of an integrated circuit (IC) device, the layout having an outer boundary and an inner boundary thereby defining a first region between the outer boundary and the inner boundary and placing a first plurality of dummy patterns in the first region, wherein the first plurality of dummy patterns is lithographically printable. The method further includes performing an Optical Proximity Correction (OPC) process, the first plurality of dummy patterns being position within the first region in such a way that prevents sub-resolution assist features from being inserted into the first region by the OPC process.
1. A method comprising:
receiving a layout of an integrated circuit (IC) device, the layout having an outer boundary and an inner boundary thereby defining an isolation region between the outer boundary and the inner boundary;
placing dummy patterns in the isolation region, wherein the dummy patterns are lithographically printable; and
performing an Optical Proximity Correction (OPC) process, the dummy patterns being positioned within the isolation region in such a way that prevents sub-resolution assist features from being inserted into the isolation region by the OPC process.
2. The method of claim 1 , wherein the layout further includes main patterns inside the inner boundary, and wherein the isolation region is free of main patterns.
3. The method of claim 1 , wherein the dummy patterns include four rectangular patterns placed adjacent to four sides of the inner boundary and enclosing the inner boundary.
4. The method of claim 1 , wherein each of the dummy patterns has a square shape.
5. The method of claim 1 , wherein the dummy patterns are spaced away from each other by a dimension that meets a layout design rule prescribing a minimum spacing between two lithographically printable features and further meets another layout design rule prescribing a maximum spacing between two lithographically printable features such that there is no room for inserting sub-resolution assist features in a space between two adjacent dummy patterns.
6. The method of claim 1 , wherein the dummy patterns are spaced away from the outer boundary by a dimension that meets a layout design rule prescribing a minimum spacing between two features when the layout is placed abutting another layout and is further small enough so as not to leave room for inserting sub-resolution assist features in a space between the dummy patterns and the outer boundary.
7. The method of claim 1 , wherein the dummy patterns have an attribute that prevents their shapes from being modified by the OPC process.
8. The method of claim 1 , wherein the layout further includes main patterns for fabricating testlines inside the inner boundary.
9. An integrated circuit (IC) layout having a device boundary and a main pattern boundary inside the device boundary, comprising:
dummy patterns in an isolation region that is between the main pattern boundary and the device boundary,
wherein:
the dummy patterns are printable in a photolithography process;
the dummy patterns surround the main pattern boundary; and
the isolation region is free of sub-resolution assist features.
10. The IC layout of claim 9 , further comprising at least one main pattern inside the main pattern boundary.
11. The IC layout of claim 9 , wherein the isolation region is free of main patterns.
12. The IC layout of claim 9 , further comprising sub-resolution assist features inside the main pattern boundary.
13. The IC layout of claim 9 , wherein the dummy patterns include four rectangular patterns placed adjacent to four sides of the main pattern boundary and enclosing the main pattern boundary.
14. The IC layout of claim 9 , wherein the dummy patterns include square patterns, rectangular patterns, or a mixture of square and rectangular patterns.
15. A photo mask, comprising:
main features of integrated circuit (IC) devices, wherein the main features are enclosed by an inner boundary that is enclosed by an outer boundary, defining an isolation region between the outer boundary and the inner boundary; and
dummy features in the isolation region, wherein the dummy features are printable in a photolithography process, wherein the isolation region is free of sub-resolution features.
16. The photo mask of claim 15 , wherein the dummy features have about uniform density in the isolation region.
17. The photo mask of claim 15 , further comprising sub-resolution features inside the inner boundary.
18. The photo mask of claim 15 , wherein the IC devices include testlines.
19. The photo mask of claim 15 , wherein the main features and the dummy features are in an area of the photo mask that corresponds to a scribe line area of a wafer.
20. The photo mask of claim 15 , wherein the dummy features include square patterns, rectangular patterns, or a mixture of square and rectangular patterns.