Patent Assignment
Reel/Frame 044701/0568
Assignment of Assignor's Interest
Recorded: 2017-11-09
Pages: 8
Assignors
YANG, DEOKKYUNG
Executed: 2017-11-08
BEAK, WOONJAE
Executed: 2017-11-08
PARK, YISU
Executed: 2017-11-08
KIM, OHHAN
Executed: 2017-11-08
LEE, HUNTEAK
Executed: 2017-11-08
LEE, HEESO
Executed: 2017-11-08
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming an Integrated Sip Module with Embedded Inductor or Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.