Patent Assignment
Reel/Frame 044714/0111
Assignment of Assignor's Interest
Recorded: 2018-01-24
Pages: 3
Assignors
IKEDA, KAZUKI
Executed: 2017-12-08
INOUE, KOSUKE
Executed: 2017-12-08
ICHIKAWA, KAZUYA
Executed: 2017-12-08
TAKEMOTO, TADASHI
Executed: 2017-12-20
Assignee
HARIMA CHEMICALS, INCORPORATED
671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA-SHI, HYOGO, 675-0019, JAPAN
Covered Property
(1)
Solder Alloy, Solder Paste, and Electronic Circuit Board