Patent Assignment
Reel/Frame 044714/0167
Assignment of Assignor's Interest
Recorded: 2018-01-24
Pages: 4
Assignors
SHIKAUCHI, HIROSHI
Executed: 2018-01-12
HOTATE, TOMONORI
Executed: 2018-01-12
TANAKA, YUKI
Executed: 2018-01-12
KUDOH, SHINJI
Executed: 2018-01-18
Assignee
SANKEN ELECTRIC CO., LTD.
3-6-3 KITANO, NIIZA-SHI, SAITAMA, 3528666, JAPAN
Covered Property
(1)
Semiconductor Wafer and Method for Forming Semiconductor