Patent Assignment
Reel/Frame 044716/0883
Assignment of Assignor's Interest
Recorded: 2018-01-24
Pages: 6
Assignors
OKUI, KAZUNORI
Executed: 2017-12-01
WANG, SHENG-MIN
Executed: 2017-12-02
HUANG, HUI-YU
Executed: 2017-12-01
Assignee
GLO AB
IDEON SCIENCE PARK, SCHEELEVÄGEN 17, LUND, S-223 70, SWEDEN
Covered Property
(1)
Molded Led Package with Laminated Leadframe and Method of Making Thereof
Application:
15/641,866 →
Publication:
US 2018/0012872
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Ip Security Agreement
Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →
Security Interest
Jan 23, 2019
From: GLO AB
To: HERCULES CAPITAL INC.
Reel/Frame 048110/0063 →
Release of Security Interest
Apr 12, 2021
From: HERCULES CAPITAL, INC.
To: GLO AB
Reel/Frame 057210/0690 →