Patent Assignment
Reel/Frame 044727/0147
Assignment of Assignor's Interest
Recorded: 2018-01-25
Pages: 7
Assignors
KIM, DONG-WOO
Executed: 2017-11-01
NOH, HYUN-HO
Executed: 2017-11-01
KIM, YONG-SEUNG
Executed: 2017-11-01
SHIN, DONG-SUK
Executed: 2017-11-10
LEE, KWAN-HEUM
Executed: 2017-11-10
JO, YU-YEONG
Executed: 2017-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Fin Structure and a Manufacturing Method Thereof