Patent Assignment
Reel/Frame 044740/0108
Assignment of Assignor's Interest
Recorded: 2018-01-26
Pages: 6
Assignors
KIM, BU-WON
Executed: 2017-12-28
LEE, DAE-HO
Executed: 2017-12-28
LEE, HEE-JIN
Executed: 2017-12-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having a Circuit Pattern