Patent Assignment
Reel/Frame 044740/0759
Assignment of Assignor's Interest
Recorded: 2018-01-26
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package with Embedded Supporter and Method for Fabricating the Same